Inductive coupling system and method for adaptive control of power transfer for wireless three-dimensional stacked chip package
US12368324B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 22, 2023 |
| Grant date | Jul 22, 2025 |
| Priority date | — |
| Expiry date | Apr 1, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06531
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed is an inductive coupling system and method for adaptive control of power transfer for a wireless three-dimensional stacked chip package. The system includes a slave chip and a master chip connected via inductive coupling; the system for adaptive control of power transfer herein shifts a load feedback voltage received by the slave chip into a feedback voltage data codeword through a level decision circuit, and the system can load the feedback voltage data codeword onto a data link of the system and feedback same to the master chip. In the present disclosure, the master chip includes a DPID control circuit controls a voltage-controlled oscillator and a frequency divider to adjust the frequency of an input clock in an energy transfer system so as to achieve adaptive control of the transmitting power of a transmitting chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.