Semiconductor device package and acoustic device having the same

US12375842B2 · kind B2 · utility

Assignee

• ADVANCED SEMICONDUCTOR ENGINEERING, INC. · TW

Inventors

• Ming-Tau Huang · Kaohsiung, TW
• Kuei-Hao Tseng · Kaohsiung, TW
• Hung-I Lin · Cambridge, US

Key dates

• Filing date: Oct 18, 2022
• Grant date: Jul 29, 2025
• Expiry date: Apr 9, 2043

Classification

• Technology area (CPC —): General

Abstract

A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.