Patent · US Active

Package device

US12376224B2 · kind B2 · utility

0Cited by

0References

20Claims

0Family size

Assignee

INNOLUX CORPORATION · TW

Inventors

Yi-Hung Lin · Jianmenkeng, TW
Chun-Hung Lai · Sha Tin, CN
Yeong-E Chen · 東區, TW
Chuan-Ming Yeh · Tainan, TW
Ching-Wei Chen · Taipei, TW

Key dates

Filing date	May 4, 2022
Grant date	Jul 29, 2025
Priority date	—
Expiry date	Sep 30, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2221/68345
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package device is provided and includes a first circuit layer, a first isolation layer, and a first de-warpage layer. The first circuit layer and the first isolation layer are stacked on each other. At least a portion of the first de-warpage layer is disposed between the first circuit layer and the first isolation layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.