Method for manufacturing a quantum electronic circuit
US12376350B2 · kind B2 · utility
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4References
14Claims
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Key dates
| Filing date | Sep 30, 2022 |
| Grant date | Jul 29, 2025 |
| Priority date | — |
| Expiry date | Feb 15, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06N10/70
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a quantum electronic circuit includes etching a semiconducting layer so as to obtain: a plurality of pillars; and a qubit layer; oxidising the flank of each pillar; forming coupling rows and coupling columns; and depositing separation layers leaving a contact surface protrude from each pillar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.