Method of assembling substrate supporting apparatus
US12377483B2 · kind B2 · utility
0Cited by
1References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 12, 2023 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Dec 7, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N13/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed herein is a method of assembling a substrate supporting apparatus, including coupling a conductive rod to an electrode installed in a substrate support provided to support a substrate, forming a sacrificial layer on the rod, bonding the rod and the electrode by melting and infiltrating a filler into a coupling area between the rod and the electrode, while forming a protective layer between the rod and the sacrificial layer by infiltrating the filler into a gap between the rod and the sacrificial layer, and coupling a shaft to the substrate support, the rod extending through the shaft.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.