Substrate processing apparatus and substrate processing method
US12377519B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2019 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Jun 12, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/304
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate processing apparatus includes a rotary table configured to move each of multiple substrate chucks to, in sequence, a carry-in position where a carry-in of a substrate is performed, a processing position where thinning of the substrate is performed, and a carry-out position where a carry-out of the substrate is performed; a tilt angle adjusting device configured to adjust a tilt angle of the substrate chuck with respect to the rotary table at the processing position; and a tilt angle controller configured to control the tilt angle adjusting device based on a measurement result of a plate thickness measuring device. The plate thickness measuring device measures a plate thickness of the substrate at the carry-out position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.