Resin composition and application thereof
US12378386B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2022 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Jul 27, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0366
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides a resin composition and an application thereof, the resin composition comprising the following components by weight percentage: 15-39% cross-linkable curable resin and 61-85% filler, the filler being silicon dioxide prepared by means of organosilicon hydrolysis, the average particle diameter D50 of the silicon dioxide being 0.1-3 μm, the ratio of D100:D10 thereof being less than or equal to 2.5, and the purity of the silicon dioxide being greater than 99.9%. The resin composition of the present invention can make prepared adhesive films and resin-coated copper foils have relatively high tensile strength and peel strength, relatively good drilling processability, controllable fluidity, good filling ability, and higher electric strength, and can achieve finer line processing ability; it is a printed circuit board material applicable to multilayer laminates, especially a printed circuit board material for multilayer laminates of thin lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.