Method of forming plasma-resistant coating layer with low brightness using heat treatment process of rare-earth metal compound powder
US12378654B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2023 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Jun 15, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2003/242
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a plasma-resistant coating layer with low brightness includes: (a) performing a heat treatment process on a primary rare-earth metal compound powder having a grain size in a range of 20 nm to 60 nm to prepare a secondary rare-earth metal compound powder, (b) transferring the secondary rare-earth metal compound powder, and (c) spraying the transferred secondary rare-earth metal compound powder onto a substrate to form a rare-earth metal compound coating layer on the substrate. In the transferring transfer, a carrier gas is used to transfer the secondary rare-earth metal compound powder. The secondary rare-earth metal compound powder obtained through the heat treatment process has a grain size in a range of 70 nm to 150 nm, and the rare-earth metal compound coating layer has a brightness value of 50 or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.