Patent · US Active

Identification codes on semiconductor chips

US12379666B2 · kind B2 · utility

0Cited by

3References

9Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Detlef Hofmann · Dohnsen, DE
Heiko Aßmann · Dresden, DE

Key dates

Filing date	Apr 20, 2023
Grant date	Aug 5, 2025
Priority date	—
Expiry date	Feb 12, 2044

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2223/5448
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of generating chip-specific identification code marks on semiconductor chips includes patterning a resist layer over a semiconductor wafer by laser direct image exposure, the patterning including writing chip-specific identification codes into the resist layer over chip areas of the semiconductor wafer. The patterned resist layer is then developed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.