Plasma processing apparatus and plasma processing method
US12381069B2 · kind B2 · utility
0Cited by
2References
17Claims
0Family size
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Key dates
| Filing date | Sep 6, 2023 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Dec 25, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/46
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A disclosed plasma processing apparatus includes a chamber, a plasma generator, a plurality of annular electromagnet units, a power source, at least one optical sensor, and a controller. The plurality of annular electromagnet units are provided coaxially with respect to an axis passing through an internal space of the chamber. The at least one optical sensor detects an emission intensity distribution of plasma along a radial direction in the chamber. The controller controls a power source to adjust currents respectively supplied to the plurality annular electromagnet units according to the emission intensity distribution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.