Die ejecting apparatus for bonding equipment
US12381099B2 · kind B2 · utility
0Cited by
2References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 21, 2022 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Jul 27, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die ejecting apparatus includes an ejector body having a cylindrical shape, ejector pins provided inside the ejector body and configured to rise or fall, a hood coupled to an upper portion of the ejector body and made of a light-transmitting material in which through holes through which the ejector pins may pass are formed, and a reinforcement member disposed in a form of a mesh mounted on the hood and overlapping the through holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.