Memory device package with noise shielding
US12381160B2 · kind B2 · utility
0Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2020 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Dec 5, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A memory device includes a grounded molding. The memory device includes a substrate having a first surface for a memory die, where the substrate has ground vias through substrate to connect to a ground reference. The substrate has a ball grid array (BGA) on the opposite surface, including perimeter balls to connect to ground connections. The grounded molding includes an electrically conductive epoxy mold to cover the memory die, where the electrical conductivity of the molding, with the molding grounded can provide radio frequency interference (RFI) shielding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.