Jun Liao
19Patents
2h-index
43Co-inventors
54Inventor score
Filing activity: Jul 16, 1998 → Apr 28, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9510766B2 | Insertable probe | Human Necessities | 13 | Active |
| US5996563A | Air intake device | Emerging Cross-Sectional Technologies | 5 | Expired |
| US10736246B2 | Electromagnetic interference shielding having a magnetically attracted shield arm | Electricity | 2 | Active |
| US10923859B2 | Crosstalk reducing connector pin geometry | Electricity | 1 | Active |
| US11116072B2 | Discrete circuit having cross-talk noise cancellation circuitry and method thereof | Electricity | 1 | Active |
| US12381160B2 | Memory device package with noise shielding | Electricity | 0 | Active |
| US12367556B2 | Artificial intelligence-based image processing method and apparatus, device, and medium | Physics | 0 | Active |
| US9554253B2 | Locating method, drive test terminal and hand-held terminal | Electricity | 0 | Active |
| US10729002B2 | Device, system and method to mitigate signal noise in communications with a memory module | Electricity | 0 | Active |
| US12025787B2 | Augmented reality microscope, image projection device and image processing system | Physics | 0 | Active |
| US10965047B2 | Connector with active circuit | Electricity | 0 | Active |
| US12235425B2 | Microscope system, smart medical device, automatic focusing method and storage medium | Physics | 0 | Active |
| US10938161B2 | Snap-on electromagnetic interference (EMI)-shielding without motherboard ground requirement | Electricity | 0 | Active |
| US11295998B2 | Stiffener and package substrate for a semiconductor package | Electricity | 0 | Active |
| US11495427B2 | Leakage protector | Electricity | 0 | Active |
| US10467160B2 | Memory channel having more than one DIMM per motherboard DIMM connector | Physics | 0 | Active |
| US11545311B2 | Electromagnetic switch | Electricity | 0 | Active |
| US10617000B2 | Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards | Electricity | 0 | Active |
| US10950536B2 | Packed interconnect structure with reduced cross coupled noise | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.