Method for embedding a component in a printed circuit board
US12382585B2 · kind B2 · utility
0Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2020 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Sep 3, 2040 |
Classification
- Technology area (CPC —)General
Abstract
A method for embedding a component in a printed circuit board or a printed circuit board intermediate product, wherein the printed circuit board or the printed circuit board intermediate product comprises at least one insulating layer made of a prepreg material, and the component is fixed by the resin of the prepreg material, is characterized by the following steps:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.