Direct liquid cooling system for electronic devices in sockets, method, and electronic device testing apparatus comprising the same
US12385947B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2023 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Jan 5, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2877
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A liquid cooling system, a liquid cooling method, and an electronic device-testing apparatus having the system are disclosed. When an electronic device is accommodated in a chip slot of a test socket, a cooling liquid supply device supplies a cooling liquid to the chip slot through a fluid inlet portion, and the cooling liquid at least flows over parts of the upper and lower surfaces of the electronic device and then flows out from a fluid outlet portion. The chip slot of the test socket serves as the flow space for the cooling liquid so that the cooling liquid can flow over the upper and lower surfaces of the electronic device, and the electronic device can be immersed in the continuously flowing cooling liquid. The flowing cooling liquid can also take away foreign matter, avoiding the influence of the foreign matter on the test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.