Artificial intelligence process control for assembly processes
US12387317B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jul 18, 2023 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Feb 14, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30164
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing system is disclosed herein. The manufacturing system includes a monitoring platform and an analytics platform. The monitoring platform is configured to capture data of an operator during assembly of an article of manufacture. The monitoring platform includes one or more cameras and one or more microphones. The analytics platform is in communication with the monitoring platform. The analytics platform is configured to analyze the data captured by the monitoring platform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.