Support unit, apparatus for treating substrate, and method for treating substrate
US12387911B2 · kind B2 · utility
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1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2021 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Mar 3, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02087
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a support unit included in an apparatus for treating a substrate by using plasma. The support unit may include: a chuck configured to support a lower surface of the substrate; a moving plate provided to surround the chuck when viewed from above; and a lifting member configured to change an exposed area of an edge region of the substrate supported by the chuck for the treating space by relatively moving the moving plate in an upper or lower direction with respect to the chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.