System for processing substrate and maintenance method thereof
US12387948B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2022 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Oct 17, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for processing a substrate using a plurality of vacuum processing chambers is provided. The system comprises: an atmospheric transfer chamber in an atmospheric atmosphere; a vacuum transfer chamber in a vacuum atmosphere; a plurality of processing modules configured by vertically arranging the vacuum processing chamber and a supplementary device; and a load lock chamber configured to switch an atmosphere therein between the atmospheric atmosphere and the vacuum atmosphere. The vacuum transfer chamber and the load lock chamber are arranged at a height position where a worker can enter thereunder, the load lock chamber and the plurality of vacuum processing chambers are connected to side surfaces of the vacuum transfer chamber, and a space below the vacuum transfer chamber is blocked from outside except for the side surface to which the load lock chamber is connected, and a space below the load lock chamber serves as a maintenance passage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.