Adaptive fill techniques for avoiding electromigration
US12387982B2 · kind B2 · utility
0Cited by
8References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 26, 2022 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Dec 14, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/528
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments are for using adaptive fill techniques to avoid electromigration, thereby resulting in electromigration signoff. A wire segment failing to meet an electromigration current limit is determined on an integrated circuit (IC). Fill shapes are connected adjacent to the wire segment to cause the wire segment to meet the electromigration current limit. The fill shapes are non-functional shapes on the IC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.