Electronic package and manufacturing method thereof
US12388062B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Sep 29, 2022 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Jan 25, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06572
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided and includes at least one electronic element, at least one first conductive structure and a second conductive structure disposed on one side of a carrier structure with at least one circuit layer, and an encapsulation layer covering the electronic element, the first conductive structure and the second conductive structure, where the first conductive structure is exposed from the encapsulation layer to externally connect required elements according to functional requirements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.