Optical sensor package structure and electronic device
US12388064B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2020 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Mar 12, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are an optical sensor package structure and a device. The optical sensor package structure includes a substrate, a signal processing chip, a photodiode and a potting adhesive layer. The signal processing chip provided on a surface of the substrate is provided with a conductive through hole, and the signal processing chip is electrically connected to the substrate via the conductive through hole. The photodiode provided on a surface of the signal processing chip away from the substrate is electrically connected to the substrate via the conductive through hole. The potting adhesive layer is for wrapping the signal processing chip and the photodiode, and an elongation at break of the potting adhesive layer is greater than 40%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.