Yanmei Sun
3Patents
1h-index
4Co-inventors
33Inventor score
Filing activity: Apr 6, 2015 → Dec 10, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10273150B2 | Integrated structure of MEMS microphone and pressure sensor and manufacturing method for the integrated structure | Electricity | 8 | Active |
| US9743646B2 | Method of establishing isogenic multi-xenograft model and the use thereof | Human Necessities | 1 | Active |
| US12388064B2 | Optical sensor package structure and electronic device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.