Controlling plating electrolyte concentration on an electrochemical plating apparatus
US12392049B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2023 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Nov 6, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2885
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.