Thermally coupled aware device placement
US12393764B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2022 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Dec 21, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/08
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Embodiments include thermally coupled aware device placement in the schematic design stage of the development of an integrated circuit. Aspects of the invention include obtaining a schematic design of a macro, the schematic design including a plurality of devices disposed within the macro. Aspects also include determining an initial temperature for each of the plurality of devices, where the initial temperature due to self-heating. Aspects further include determining, iteratively for each of the plurality of devices, an uplift temperature, where the uplift temperature for a first device of the plurality of devices is determined based on the initial temperature of each of the other plurality of devices and a distance between the first device and each of the other plurality of devices as encoded in the schematic design. Aspects also include modifying the schematic design of the macro based on a determination that the uplift temperature of at least one of the plurality of devices is above a threshold value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.