Method of adjusting wafer shape using multi-directional actuation films
US12394618B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2022 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Nov 27, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/302
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Techniques herein include methods for coating a single layer actuator film or multi-layer actuator film on the backside of a wafer. The actuator film includes one or more chemical actuators. Chemical actuators are various molecules, crystals, chemical compounds and other chemical compositions that are capable of imposing directional stress in response to application of an external stimulus on the chemical actuator. The external stimulus can include a particular wavelength of light or polarization of light, or heat (or directed infrared radiation) or load, which can include load-responsive actuation or pressure-responsive actuation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.