Substrate polishing system
US12394627B2 · kind B2 · utility
0Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2022 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Oct 11, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate polishing system may include a substrate transfer unit comprising a shaft to rotate on a rotation axis perpendicular to a ground and at least one transfer arm to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit by rotation of the shaft, and at least one carrier to perform polishing the substrate transferred by the substrate transfer unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.