Methods and apparatus to increase glass core thickness
US12394719B2 · kind B2 · utility
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23Claims
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Key dates
| Filing date | Sep 22, 2021 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Dec 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49827
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus to increase glass core thickness are disclosed. An example apparatus includes a first glass substrate, a second glass substrate, an interface layer between the first glass substrate and the second glass substrate, the interface layer coupling the first glass substrate to the second glass substrate, and an interconnect extending through at least a portion of the first glass substrate and at least a portion of the second glass substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.