Die attachment structure and method for manufacturing the same
US12394743B2 · kind B2 · utility
0Cited by
1References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 1, 2021 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Oct 6, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83856
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die attachment structure can include: a base; a die located above a first surface of the base; a first adhesive layer located on a back surface of the die, wherein the die is pasted on the first surface of the base at least by the first adhesive layer; and a second adhesive layer at least partially covering the sidewalls of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.