Semiconductor device including bonding covers
US12394745B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2022 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Jan 18, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48455
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a die pad, a bond post, a die disposed over the die pad, a wire coupled between the die and the bond post and having a first portion bonded to the die at a first bond area and a second portion bonded to the bond post at a second bond area, a first bonding cover disposed over the first portion, and a second bonding cover disposed over the second portion. A method includes bonding a first portion of a wire to a die at a first bond area, bonding a second portion of the wire to a first bond post of a lead frame at a second bond area, applying a bonding material over the first bond area to form a first bonding cover, and applying the bonding material over the second bond area to form a second bonding cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.