Optically-enhanced multichip packaging
US12395246B2 · kind B2 · utility
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15References
8Claims
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Key dates
| Filing date | Jun 27, 2023 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Jun 27, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B10/502
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Optical chip-to-chip interconnects may use microLEDs as light sources. The interconnected chips may be on a same substrate. A pair of endpoint chips may each have associated optical transceiver subsystems, with transceiver circuitry in transceiver chips. Optical communications may be provided between the optical transceiver subsystems, with the optical transceiver subsystems in communication with their associated endpoint chips by way of metal layers in the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.