Circuit board structure and manufacturing method thereof
US12396100B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2023 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Nov 24, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10977
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board structure including a first circuit board, a second circuit board, a conductive coil and a first molding compound and a manufacturing method thereof. The first circuit board has a first side surface. The second circuit board has a second side surface facing the first side surface and being spaced apart from the first side surface. The conductive coil is in a spiral shape and includes a first coil pattern and a second coil pattern. The first coil pattern is disposed in the first circuit board. The second coil pattern is disposed in the second circuit board. The first coil pattern is electrically connected to the second coil pattern. The first molding compound is magnetic and filled in a gap located between the first side surface and the second side surface. The conductive coil surrounds at least a part of the first molding compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.