Fixed-position defect doping method for micro-nanostructure, and NV center sensor
US12398454B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2020 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Aug 20, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/042
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure provides a fixed-position defect doping method for a micro-nanostructure based on a self-alignment process, including: S1, sequentially forming a sacrificial layer and a photoresist layer on a surface of a crystal substrate; S2, performing a lithography on the photoresist layer to form a mask hole according to a micro-nano pattern; S3, performing an isotropic etching on the sacrificial layer through the mask hole, and amplifying the micro-nano pattern to the sacrificial layer; S4, performing an ion implantation doping on an exposed crystal surface below the mask hole; S5, removing the photoresist layer, and depositing a mask material; S6, removing the sacrificial layer, and transferring a micro-nano amplified pattern in the sacrificial layer to a mask material pattern; and S7, etching an exposed crystal surface, and removing the mask material on the surface and forming a specific defect by annealing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.