Patent · US Active

Cantilever with etch chamber flow design

US12400834B2 · kind B2 · utility

0Cited by
8References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 18, 2021
Grant dateAug 26, 2025
Priority date
Expiry dateMay 23, 2043

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2237/334
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A cantilever for gas flow direction control configured to support an electrode housing bowl in an associated etch process chamber. The cantilever may have a cross-section that is circular, elliptical, or airfoil shaped. The shape of the cantilever induces the flow of gas and etch products within the chamber around the cantilever, reducing turbulence around the edge of a wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.