Controlling warpage of a substrate for mounting a semiconductor die
US12400971B2 · kind B2 · utility
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3References
13Claims
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Assignee
Inventors
Key dates
| Filing date | Jul 21, 2021 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Sep 1, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate and a method for manufacturing the substrate. The substrate is suitable for mounting at least one semiconductor die onto a printed circuit board. The substrate comprises two opposing stacks, with each stack comprising alternating layers of copper and electrically insulating film. The film and the copper have different co-efficients of thermal expansion, allowing the warpage behaviour of the substrate to be controlled by providing the substrate with different film thicknesses between the opposing stacks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.