Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
US12400995B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2022 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Mar 1, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/80908
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a semiconductor manufacturing apparatus includes a magnification difference acquirer configured to acquire a value of difference in magnification between a first substrate and a second substrate. The apparatus further includes a deformation amount determiner configured to determine a value of deformation amount of a chuck that holds the first or second substrate, based on the value of the difference in magnification. The apparatus further includes a gap determiner configured to determine a value of a gap between the first substrate and the second substrate, based on the value of the deformation amount. The apparatus further includes a bonding controller configured to control the deformation amount to the determined value and control the gap to the determined value, before the first substrate and the second substrate are bonded together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.