Hiroaki ASHIDATE
11Patents
3h-index
12Co-inventors
53Inventor score
Filing activity: Feb 7, 2014 → Feb 28, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9679867B2 | Semiconductor device having a low-adhesive bond substrate pair | Electricity | 10 | Active |
| US10090351B2 | Semiconductor device having gaps within the conductive parts | Electricity | 10 | Active |
| US10109508B2 | Substrate processing device and method of manufacturing semiconductor device | Electricity | 5 | Active |
| US10978316B2 | Semiconductor processing device | Performing Operations; Transporting | 1 | Active |
| US11069700B2 | Semiconductor storage device and method of manufacturing the same | Electricity | 1 | Active |
| US9269734B2 | Method of manufacturing solid-state imaging device | Electricity | 0 | Active |
| US12400981B2 | Method for manufacturing semiconductor device | Electricity | 0 | Active |
| US12400995B2 | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device | Electricity | 0 | Active |
| US11171020B2 | Substrate treatment apparatus | Electricity | 0 | Active |
| US12027380B2 | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device | Electricity | 0 | Active |
| US12046487B2 | Substrate treatment apparatus and substrate treatment method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.