Laser processing apparatus and laser processing method
US12403548B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2021 |
| Grant date | Sep 2, 2025 |
| Priority date | — |
| Expiry date | May 14, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B2290/65
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A laser processing apparatus includes a laser oscillator that oscillates processing laser light to be incident on a processing point on a processing surface of a workpiece, a coupling mirror that deflects or transmits the processing laser light and measurement light to be incident on the processing point toward the processing point, a measurement light deflection unit that changes an incident angle of the measurement light on the coupling mirror, a lens that concentrates the processing laser light and the measurement light on the processing point, a controller that controls the laser oscillator and the measurement light deflection unit, a measurement processor that measures a depth of a keyhole generated at the processing point by the processing laser light by using an optical interference signal based on an interference generated by an optical path difference between the measurement light reflected at the processing point and reference light, and a beam position measurement unit that measures positions of the processing laser light and the measurement light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.