Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device
US12405198B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Oct 26, 2020 |
| Grant date | Sep 2, 2025 |
| Priority date | — |
| Expiry date | May 30, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13144
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
method for selecting a photosensitive resin composition exposing a resin film of a photosensitive resin composition at 100 to 2000 mJ/cm2 and heat-treating the resin film at 150° C. to 5 250° C. for 1 to 3 hours under nitrogen to produce a strip sample of a cured film having a film thickness of 10 μm and a width of 10 mm; performing a fatigue test of repeatedly pulling the strip sample under specific conditions; and selecting a photosensitive resin composition satisfying the following condition: the number of times of pulling required until the 15 strip sample breaks in the fatigue test is 100 or more cycles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.