Semiconductor substrate processing apparatus
US12412768B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2022 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Sep 8, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67772
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor substrate processing apparatus includes a substrate transfer module including a chamber having an internal space extending in a first direction within the chamber, at least one pair of first load ports at opposite sides of the chamber, to face in a second direction intersecting the first direction, and configured to rotate and move a substrate carrier, a load lock at a rear surface of the chamber, and a robot arm configured to move in the first direction in the internal space of the chamber, a transfer chamber connected to the load lock of the substrate transfer module, a plurality of processing chambers connected to the transfer chamber, and a transfer arm inside the transfer chamber, and configured to unload the semiconductor substrate from the load lock and to load the semiconductor substrate into at least one of the plurality of processing chambers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.