Cold plate and manifold integration for high reliability
US12412808B1 · kind B1 · utility
0Cited by
48References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2024 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Dec 20, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06589
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device package comprising an integrated cooling assembly. The device package comprises a semiconductor device attached to a substrate and a cold plate attached to the semiconductor device. The cold plate's footprint is larger than the footprint of the semiconductor device so one or more portions of the cold plate extends past the edges of the semiconductor device's footprint. One or more standoffs are disposed adjacent to the semiconductor device to support the one or more portions of the cold plate that extend past the edges of the semiconductor device's footprint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.