Plating apparatus
US12416092B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2021 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | Oct 28, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a technique that can suppress deterioration of plating quality of a substrate due to gas bubbles that remain entirely on a lower surface of a membrane.A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, and a membrane module 40. The membrane module includes a first membrane 41 and a second membrane 42. The second membrane has an inflow port 42c for causing a plating solution in a first region R1 below the second membrane to flow into a second region R2 above the second membrane and below the first membrane, and an inclined portion 42b inclining relative to a horizontal direction and inclining so as to be positioned upward as heading from a center side of an anode chamber to an outer edge side of the anode chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.