Electroless plating process
US12416093B2 · kind B2 · utility
0Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2021 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | Nov 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6723
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure is directed to an electroless plating process using a panel basket for holding semiconductor panels comprising a plurality of metal pads and shielding the metal pads from contaminants and over-etching and under-etching caused by the contaminants.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.