Protection ring, method for forming protection ring, and semiconductor structure
US12419105B2 · kind B2 · utility
0Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2022 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | Jan 23, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/535
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A protection ring, a method for forming a protection ring, and a semiconductor structure are provided. The protection ring at least includes a buried protection structure. The buried protection structure is arranged in a semiconductor substrate. The buried protection structure is configured to protect a first functional structure formed inside the semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.