Polishing head assembly having recess and cap
US12420376B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2022 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Dec 15, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing head assembly for polishing of semiconductor wafers includes a polishing head and a cap. The polishing head has a recess along a bottom portion. The recess has a recessed surface. The cap is positioned within the recess. The cap includes an annular wall secured to the polishing head and a floor joined to the annular wall at a joint. The floor extends across the annular wall, and the floor has an upper surface and a lower surface. The upper surface is spaced from the recessed surface to form a chamber therebetween. A deformation resistance of a portion of the floor proximate the joint is weakened to allow the portion of the floor proximate the joint to deflect relative to the polishing head by a change of pressure in the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.