High reliability lead-free solder alloy for electronic applications in extreme environments
US12421574B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2023 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Jun 29, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/025
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, titanium, and antimony. The alloy may further comprise antimony, nickel, or both. The silver may be present in an amount from about 3.1% to 3.8% by weight of the solder. The copper may be present in an amount from about 0.5% to 0.8% by weight of the solder. The bismuth may be present in an amount from about 0.0% (or 1.5%) to about 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.03% to about 1.0% (or 0.05%) by weight of the solder. The titanium may be present in an amount from about 0.005% to about 0.02% by weight of the solder. The antimony may be present in an amount between about 1.0% to about 3.0% by weight of the solder. The balance of the solder is tin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.