Deflectable platens and associated methods
US12424452B2 · kind B2 · utility
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3References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 1, 2022 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Jan 7, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6835
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A deflectable platen including a first layer formed of a material having a first coefficient of thermal expansion (CTE), and a second layer bonded to the first layer and having a second CTE, the second layer including a plurality of electrodes embedded therein for facilitating electrostatic clamping of wafers to the second layer, wherein the second CTE is different than the first CTE.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.