System and method for modification of substrates
US12424498B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2019 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Feb 2, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D1/26
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Various embodiments of the present technology generally relate to substrate planarization. More specifically, some embodiments of the present technology relate a versatile systems and methods for precision surface topography optimization known as planarization on nominally planar substrates. In some embodiments, a method for planarization of a patterned substrate using inkjets can determine the global and nanoscale topography and pattern information of the patterned substrate. Based upon the global and nanoscale topography and pattern information, a drop pattern can be determined and then dispensed on the patterned substrate. A gap between the patterned substrate and a superstrate causing the dispensed drops can be closed to form a substantially contiguous film. The substantially contiguous film can be cured and the superstrate can be separated from the patterned substrate with substantially contiguous film on the patterned substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.