Patent · US Active

Component embedded in component carrier and having an exposed side wall

US12424504B2 · kind B2 · utility

0Cited by

2References

19Claims

0Family size

Assignee

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft · AT

Inventors

Bettina Schuster · Leoben, AT
Jonathan Silvano de Sousa · Wien, AT
Andreas Zluc · Leoben, AT
Markus Leitgeb · Trofaiach, AT
Hannes Stahr · Kindberg, AT

Key dates

Filing date	Dec 28, 2022
Grant date	Sep 23, 2025
Priority date	—
Expiry date	Jul 28, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/0228
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for manufacturing a component carrier includes i) providing a metal layer, in particular a copper layer; ii) forming a film on the metal layer; iii) patterning the film in order to expose a part of the metal layer; iv) carrying out a first etch, thereby thinning the film and removing a further part of the exposed metal layer; and thereafter v) carrying out a second etch, thereby forming at least one metal trace that is spatially separated from the metal layer. A component carrier made by the method is further described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.