Technologies for isolated heat dissipating devices

US12424513B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Prabhakar Subrahmanyam · San Jose, US
• Tong Wa Chao · Chandler, US
• Ying-Feng PANG · Portland, US
• Yi Xia · Beijing, CN
• Rahima K. Mohammed · San Jose, US
• Victor Polyanko · Kent, US
• Ridvan A. Sahan · Sunnyvale, US
• Guangying Zhang · Chandler, US
• Guoliang Ying · Sichuan, CN
• Chuanlou Wang · Shanghai, CN
• Jun Lu · San Jose, US
• Liguang DU · Shanghai, CN
• Peng Wei · Nanhu, CN
• Xiang Que · Shanghai, CN

Key dates

• Filing date: Mar 6, 2021
• Grant date: Sep 23, 2025
• Expiry date: Jul 19, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L23/4006
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.