Circuit board structure and method for forming the same
US12426168B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2022 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | May 25, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0207
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board structure is provided. The circuit board structure includes a via hole, a conductive layer, and an alternate stacking of a plurality of circuit layers and a plurality of insulating layers. The via hole penetrates through the plurality of circuit layers and the plurality of insulating layers. The lateral ends of the plurality of insulating layers form the sidewall of the via hole. The conductive layer is conformally disposed within the via hole. The conductive layer exposes the first region of the sidewall and covers the second region of the sidewall. The sidewall extends in the longitudinal direction of the via hole and has no misalignments in the radial direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.